Annuaire des chercheurs et enseignants-chercheurs de Centrale Lille
Nicolas Botter received his PhD in 2022 from Université Grenoble Alpes, carried out in collaboration with Safran Tech within the G2Elab and SIMaP laboratories. In 2022, he completed a postdoctoral fellowship at Fraunhofer IZM in Berlin. He then continued his research at G2Elab in Grenoble as a postdoctoral fellowship. Since 2023, he has been an Associate Professor at the L2EP laboratory in Lille.
His research focuses on the packaging of wide-bandgap components (SiC, GaN). During his PhD, he worked on optimizing silver sintering die-attach processes and on the reliability of assemblies subjected to severe thermal cycling. His postdoctoral positions allowed him to broaden this expertise to the design of modules with embedded components and to the electromagnetic compatibility of switching cells. Since joining L2EP, he has been particularly interested in the cooling of power components.
Power Electronics; Packaging; Wide-Bandgap Components; Cooling; Power Module; SiC; GaN
Fabrication and characterization of low value embedded resistors for use in PCB embedded RC snubber for more integrated converte
CIPS 2024; 13th International Conference on Integrated Power Electronics Systems, Mar 2024, Düsseldorf, Germany
Alejandro Can-Ortíz,Vincent Bley,N. Botter,Yvan Avenas
Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly
CIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340
Moisés Ferber,Paul Bruyère,Nicolas Botter,Alejandro Can,Souhila Bouzerd,Jean-Michel Guichon,Jean-Luc Schanen,Alexis Derbey,Eric Vagnon,Céline Combettes,Vincent Bley,Emmanuel Sarraute,Laurent Dupont,Yvan Avenas
Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering
IEEE Transactions on Device and Materials Reliability, 2023, 23 (2), pp.211--218. ⟨10.1109/TDMR.2023.3246598⟩
Nicolas Botter,Rabih Khazaka,Yvan Avenas,Jean-Michel Missiaen,Didier Bouvard,Stephane Azzopardi
Power Module Using Ceramic Heat Sink and Multilayers Silver Sintering
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, 12 (7), pp.1082-1090. ⟨10.1109/TCPMT.2022.3179432⟩
Nicolas Botter,Rabih Khazaka,Yvan Avenas,Didier Bouvard,Jean-Michel Missiaen
Design of Wire Bondless Double-Sided Cooled Power Module Using Ceramic Heat Sink and Multilayer Silver Sintering
PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2022, Nuremberg, Germany
Nicolas Botter,Rabih Khazaka,Yvan Avenas,Didier Bouvard,Jean-Michel Missiaen
Etude de l'assemblage d'un module de puissance SiC sur radiateur céramique avec refroidissement double face
Energie électrique. Université Grenoble Alpes [2020-..], 2022. Français. ⟨NNT : 2022GRALT005⟩
Nicolas Botter
Power Module Using Ceramic Heat Sink and Multilayers Silver Sintering
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, 12 (7), pp.1082-1090. ⟨10.1109/TCPMT.2022.3179432⟩
Nicolas Botter,Rabih Khazaka,Yvan Avenas,Didier Bouvard,Jean-Michel Missiaen
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering
Microelectronics Reliability, 2021, 126, pp.114206. ⟨10.1016/j.microrel.2021.114206⟩
N. Botter,R. Khazaka,Y. Avenas,J.M. Missiaen,D. Bouvard,S. Azzopardi
Reduction of Thermal Interfaces with New Processes and Materials.
International Workshop on Integrated Power Packaging (IWIPP 2021), Apr 2021, Webinar, France
Nicolas Botter,Yvan Avenas,Jean-Michel Missiaen,Didier Bouvard,Rabih Khazaka
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering
32nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, LAAS CNRS; IMS Bordeaux, Oct 2021, Bordeaux, France. pp.114206, ⟨10.1016/j.microrel.2021.114206⟩
N. Botter,R. Khazaka,Y. Avenas,J.M. Missiaen,D. Bouvard,S. Azzopardi
Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks
CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, May 2020, Berlin, Germany
Nicolas Botter,Yvan Avenas,Missiaen J.M.,Didier Bouvard,Rabih Khazaka
